长沙理工大学学报(自然科学版)
具有圆形P+区的1 200 V SiC JBS二极管的研究
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作者单位:

(长沙理工大学 物理与电子科学学院,湖南 长沙 410114)

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通讯作者:

吴丽娟(1974—) (ORCID:0000-0001-9305-1656),女,副教授,主要从事功率半导体器件方面的研究。 E-mail:305719669@qq.com

中图分类号:

TN311+.7

基金项目:

湖南省自然科学基金(2024JJ5044);湖南省教育厅科研基金(19K001)


Research on 1 200 V SiC JBS diode with circular P+ regions
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(School of Physics & Electronic Science, Changsha University of Science & Technology, Changsha 410114, China)

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    摘要:

    【目的】通过改变碳化硅(silicon carbide,SiC)结势垒肖特基二极管(junction barrier Schottky diode,JBS)的P+掺杂区的形状,将常规SiC JBS条形分布的P+掺杂区优化为圆形P+掺杂区,并两两之间以正三角形分布于肖特基接触之间。【方法】通过三维结构有限元仿真方法模拟以上两种SiC JBS结构的正反向特性,优化P+掺杂区宽度和外延层掺杂浓度,并进行对比分析。【结果】仿真结果显示,两种结构的反向击穿电压均高于1 500 V,圆形P+掺杂区JBS二极管的正向导通压降比条形P+掺杂区JBS二极管的低:在正向电流密度为400 A/cm2时,导通压降由条形P+结构的2.37 V降低至圆形P+结构的2.05 V,降低了13.5%;圆形P+结构在经过优化外延层掺杂浓度后,其在正向电流密度为400 A/cm2时的导通压降为1.97 V,较条形P+结构的降低了16.9%。相较于条形SiC JBS,圆形P+结构具有更大的肖特基接触面积,在保证击穿电压的同时可以获得更低的导通压降,并通过优化器件的外延层掺杂浓度进一步降低器件的导通压降。【结论】本文将P+掺杂区形状由条形调整为圆形,并以正三角形分布排列。这种调整增大了器件的肖特基接触面积,优化了正向导通特性,并通过优化器件的外延层掺杂浓度进一步提高了导通特性,获得了更低的导通压降。

    Abstract:

    [Purposes] This paper aims to optimize the shape of the P+ doping region of the junction barrier Schottky (JBS) diose of siliconcarbide (SiC) by changing the strip-shaped P+ doping regions in conventional SiC JBS to the circular P+ doping regions, which are distributed between the Schottky contacts in regular triangles. [Methods] The forward and reverse characteristics of the above two SiC JBS structures were simulated by the three-dimensional structural finite element simulation method, and the width of the P+ doping region and the doping concentration of the epitaxial layer were optimized and compared. [Findings] The simulation results show that the reverse breakdown voltage is higher than 1 500 V for both structures, and the forward conduction voltage drop of the JBS diode with circular P+ doping region is lower than that of the JBS diode with strip-shaped P+ doping region. When the forward current density is 400 A/cm2, the conduction voltage drop decreases from 2.37 V in the strip-shaped P+ structure to 2.05 V in the circular P+ structure, which is reduced by 13.5%. After optimizing the doping concentration of the epitaxial layer in the circular P+ structure, the conduction voltage drop at a forward current density of 400 A/cm2 is 1.97 V, which is 16.9% lower than that of the strip P+ structure. Compared to the strip-shaped SiC JBS, the circular P+ structure has a larger Schottky contact area, ensuring breakdown voltage while achieving a lower conduction voltage drop. By optimizing the doping concentration of the epitaxial layer, the conduction voltage drop of the device is further intensified. [Conclusions] In this paper, the P+ doping region is adjusted from a strip shape to a circular one and arranged in a regular triangular distribution. This adjustment increases the Schottky contact area of the device, optimizes the forward conduction characteristics of the device, and further improves the conduction characteristics by optimizing the doping concentration of the epitaxial layer of the device. At the same time, a lower conduction voltage drop is obtained.

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引用本文

吴丽娟,张腾飞,张梦源,等.具有圆形P+区的1 200 V SiC JBS二极管的研究[J].长沙理工大学学报(自然科学版),2024,21(4):168-175,187.
WU Lijuan, ZHANG Tengfei, ZHANG Mengyuan, et al. Research on 1 200 V SiC JBS diode with circular P+ regions[J]. Journal of Changsha University of Science & Technology (Natural Science),2024,21(4):168-175,187.

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  • 收稿日期:2023-11-20
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  • 在线发布日期: 2024-09-30
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