[Purposes]Aiming at the problems of incomplete filling, continuous deformation, and stress concentration in the hot embossing of polymer microneedle array, the influence of embossing parameters on the residual stress and the average filling depth is explored by the combination of simulation and experiments to meet the demand of high-precision batch manufacturings.[Methods]Based on the study of thermo-mechanical properties of polymer materials, the finite element model of microneedle array is established, and the effects of embossing temperature, rate and amount on the residual stress and its distribution are analyzed.In addition, hot embossing experiments are carried out.The influence of the above molding parameters on the microneedle filling, and the comparison between the simulation and the experimental values of the average filling depth are also discussed.[Findings]The results show that the maximum forming stress decreases first and then increases with the increase of embossing temperature, while the maximum forming stress increases with the rise of embossing rate and amount. The simulation values of the average filling depth are consistent with the experimental ones except when the embossing temperature is higher than 125 ℃, and all simulated values are greater than the experimental ones. In addition, the optimal parameters, that is,the embossing temperature of 125 ℃, the embossing rate of 10 μm/s and the embossing amount of 2.6 mm, are obtained.[Conclusions]The numerical simulation results are highly instructive in a certain temperature range. The residual stress and the average filling depth of the polymer microneedle array structure have some sensitive temperature and time correlations.