[Purposes] The study aims to alleviate the demand of natural fine aggregate for cement stabilized macadamia base, the problem of waste circuit board non-metallic materials being difficult to deal with was solved. [Methods] Non-metallic materials recycled from waste printed circuit Boards （NWPCB) was substituted by equal volume for fine aggregates of 0~0.075 mm and 0.6~1.18 mm in cement stabilized macadam, and styrene butadiene emulsion was added to optimize the performance of NWPCB-cement stabilized macadam. Through dry shrinkage test, temperature shrinkage test, freeze-thaw cycle test and dry-wet cycle test, the influence of NWPCB incorporation on the damage resistance of cement stabilized macadamia was studied, and the effect of styrene butadiene emulsion modified NWPCB cement stabilized macadamia was proved. [Findings] The average shrinkage coefficient of NWPCB-cement stabilized crushed stone is 5.4% larger than that of conventional cement stabilized crushed stone, and the average shrinkage coefficient of NWPCB-cement stabilized crushed stone is 4.8% lower than that of ordinary cement stabilized crushed stone. After freeze-thaw cycle and dry-wet cycle, the residual value of 28 d unconfined compressive strength of NWPCB-cement stabilized crushed stone is above 90%. The above indexes of the NWPCB-cement stabilized crushed stone modified by butadiene emulsion are better than those of the unmodified NWPCBvcement stabilized crushed stone. [Conclusions] Cement stabilized crushed stone mixed with NWPCB still has good temperature and humidity resistance, and butadiene emulsion can play an optimization role.